Packaging jobs in hillsboro USA
101 packaging jobs found in hillsboro: showing 1 - 50
Warehouse Operator
Company: DSV |
by transporting, storing, packaging, re-packaging, processing and clearing all types of goods. We work every day from our many offices... in a logistics/distribution/relevant environment. Able to operate MHE with packaging and labeling experience Previous mechanicalLocation: Hillsboro, OR, USA
| Salary: US$25 - 27 per hour | Date posted: 19 Jul 2026
Warehouse Operator
Company: DSV |
by transporting, storing, packaging, re-packaging, processing and clearing all types of goods. We work every day from our many offices... in a logistics/distribution/relevant environment. Able to operate MHE with packaging and labeling experience Previous mechanicalLocation: Hillsboro, OR, USA
| Salary: US$25 - 27 per hour | Date posted: 18 Jul 2026
Supervisor Field Support Sr
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., reticles, integrated circuits, packaging, printed circuit boards, and flat panel displays. Innovation is at the coreLocation: Hillsboro, OR, USA
| Salary: US$81300 - 138200 per year | Date posted: 17 Jul 2026
Module Development Defect Inspection Engineer
Company: Intel |
for process optimization and continuous improvement. Packaging processes, equipment automation development, or projectLocation: Hillsboro, OR, USA
| Salary: US$99030 - 188890 per year | Date posted: 17 Jul 2026
Itad Technician I / Shipping & Receiving Specialist I
Company: Bold New Solutions - BNS Power |
inventory in designated warehouse locations. Prepare outbound shipments, including packaging, labeling, palletizing..., sorting, scanning, and packaging items. Ability to climb ladders or step stools as needed to access inventory. SafelyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 16 Jul 2026
Ehs Engineer
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: US$103730 - 198820 per year | Date posted: 16 Jul 2026
Senior Test Engineer
Company: Microsoft |
-functional partners. Support semiconductor IC development across fabrication, manufacturing test, and packaging phasesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 16 Jul 2026
Senior Material Handler
Company: DSV |
. Today, we add value to our customers' entire supply chain by transporting, storing, packaging, re-packaging, processing and clearingLocation: Hillsboro, OR, USA
| Salary: US$21 per hour | Date posted: 15 Jul 2026
Material Handler/ Parts Runner
Company: WGNSTAR |
, including packaging, loading, and coordinating standard and nonstandard crating requirements Operate material handlingLocation: Hillsboro, OR, USA
| Salary: US$38 - 42 per hour | Date posted: 15 Jul 2026
Process Integration Development Engineer
Company: Intel |
state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology..., through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundryLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Material Handler/ Parts Runner
Company: WGNSTAR |
, including packaging, loading, and coordinating standard and nonstandard crating requirements Operate material handlingLocation: Hillsboro, OR, USA
| Salary: US$38 - 42 per hour | Date posted: 15 Jul 2026
Logistics Coordinator, Cec
Company: DSV |
. Today, we add value to our customers' entire supply chain by transporting, storing, packaging, re-packaging, processing and clearingLocation: Hillsboro, OR, USA
| Salary: US$20.75 - 27.75 per hour | Date posted: 15 Jul 2026
Senior Ic Packaging Engineer
Company: Microsoft |
and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support... and production. Drive optimal silicon packaging solution supporting Azure datacenter product roadmap. Drive package technologyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Intel Foundry Process Integration And Yield Technician - Metrology
Company: Intel |
cutting-edge silicon process and packaging technology leadership for the AI era. From advanced process nodes and global... manufacturing scale to yield improvements, advanced packaging, and final test and assembly, we are committed to enablingLocation: Hillsboro, OR, USA
| Salary: US$51710 - 85340 per year | Date posted: 15 Jul 2026
Intel Foundry Process Integration And Yield Technician - Metrology
Company: Intel |
cutting-edge silicon process and packaging technology leadership for the AI era. From advanced process nodes and global... manufacturing scale to yield improvements, advanced packaging, and final test and assembly, we are committed to enablingLocation: Hillsboro, OR, USA
| Salary: US$51710 - 85340 per year | Date posted: 15 Jul 2026
Process Integration Development Engineer
Company: Intel |
state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology..., through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundryLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Material Handler Ii
Company: GXO Logistics |
do on a typical day: Support operations by moving materials and inventory throughout the facility Construct packaging boxes and pickLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Senior Integration Engineer
Company: Jireh Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$95000 - 140000 per year | Date posted: 14 Jul 2026
Senior Equipment Engineer (thin Films)
Company: Jireh Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$95000 - 140000 per year | Date posted: 14 Jul 2026
Equipment Technician-nights
Company: Jireh Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$36 - 55 per hour | Date posted: 14 Jul 2026
Senior Procurement Specialist
Company: Jireh Semiconductor |
technology, product design, and advanced packaging know-how to develop high performance power management solutionsLocation: Hillsboro, OR, USA
| Salary: US$75000 - 95000 per year | Date posted: 14 Jul 2026
Senior Field Support Supervisor
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$81300 - 138200 per year | Date posted: 14 Jul 2026
Hbi Module Development Engineer
Company: Intel |
technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures... of industry experience in hybrid bonding, wafer bonding, advanced packaging, Preferred Qualifications Experience leadingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 14 Jul 2026
Ltd Ret Software Research Engineer/scientist
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 14 Jul 2026
Aptm Npi Integrator
Company: Intel |
packaging and technology development programs. The successful candidate will drive the integration of new technologies... Integration: Experience in integrating packaging processes with overall product manufacturing workflows. Package DesignLocation: Hillsboro, OR, USA
| Salary: US$89010 - 125660 per year | Date posted: 14 Jul 2026
Equipment Technician-nights
Company: Alpha & Omega Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$36 - 55 per hour | Date posted: 13 Jul 2026
Senior Equipment Engineer (thin Films)
Company: Alpha & Omega Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$95000 per year | Date posted: 13 Jul 2026
Senior Integration Engineer
Company: Alpha & Omega Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$95000 per year | Date posted: 13 Jul 2026
Senior Procurement Specialist
Company: Alpha & Omega Semiconductor |
technology, product design, and advanced packaging know-how to develop high performance power management solutionsLocation: Hillsboro, OR, USA
| Salary: US$75000 - 95000 per year | Date posted: 12 Jul 2026
Module Development Defect Inspection Engineer
Company: Intel |
understanding and development experience. Experience with packaging processes, equipment automation development, or project... our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enablingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 12 Jul 2026
Specimen Receiving & Processing Technician (medical Laboratory Technician 1)
Company: State of Oregon |
records, effective communication, and safely packaging and shipping infectious agents. Desired Attributes: The followingLocation: Hillsboro, OR, USA
| Salary: US$3952 - 5458 per month | Date posted: 11 Jul 2026
Customer Applications Development Engineer, Mach Hillsboro/beaverton
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 11 Jul 2026
Material Handler Ii - Weekend Day Shift
Company: GXO Logistics |
operations by moving materials and inventory throughout the facility Construct packaging boxes and pick merchandise VerifyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 10 Jul 2026
Account Manager Fab Equipment Sourcing
Company: Intel |
and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale... and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assemblyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 09 Jul 2026
Manufacturing Associate Technician
Company: Genentech |
in a state-of-the-art, automated production and packaging facility. Troubleshoot, maintain, and assemble all production equipment..., inspection, packaging equipment, and execute production recipes using SAP and MES systems. Perform bulk thaw, dilutionLocation: Hillsboro, OR, USA
| Salary: US$42400 - 78800 per year | Date posted: 09 Jul 2026
Watd Module Development Engineer
Company: Intel |
Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging... assembly, semiconductor equipment developing/processing, or advanced packaging technology development. This positionLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 09 Jul 2026
Onsite Field Service Engineer Ii (em Refurbishment)
Company: Thermo Fisher Scientific |
to standard factory specifications and packaging and shipping out these systems. The Position In this role you will supportLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 07 Jul 2026
Product Development Applications Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., and packaging. Ability to diagnose and resolve basic customer issues. Strong communication skills especially technical writingLocation: Hillsboro, OR, USA
| Salary: US$83100 - 141300 per year | Date posted: 07 Jul 2026
Advanced Packaging Lithography Development Manager
Company: Intel |
Job Details: Job Description: Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager... to lead our lithography development for next-generation packaging solutions. This role will drive the developmentLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 07 Jul 2026
Advanced Packaging Dry Etch Module Development Engineer
Company: Intel |
to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch... processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 07 Jul 2026
Ehs Environmental Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$120860 - 170630 per year | Date posted: 06 Jul 2026
Customer Engagement Applications Engineer (fast)
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 06 Jul 2026
Mfg Systems Software Development Engineer
Company: Intel |
state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology..., through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundryLocation: Hillsboro, OR, USA
| Salary: US$52000 - 200000 per year | Date posted: 03 Jul 2026
Applications Development Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., FinFET/GAA) Memory (DRAM, 3D NAND) Advanced packaging (e.g., film stacks, redistribution layers) Assist in developing newLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 02 Jul 2026
Global Operations Supply Chain Engineer - Oregon
Company: Intel |
manufacturing processes and advanced packaging technologies Exceptional analytical capabilities, enabling success in ambiguous... -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to designLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Jul 2026
Yield Development Engineering Manager-strategic Programs
Company: Intel |
technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define... acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. Experience in advanced packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Jul 2026
Yield Development Engineering Manager-strategic Programs
Company: Intel |
technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define..., cycle time, and revenue impact. Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneousLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Jul 2026
Senior Staff Process Engineer – Dry Etch
Company: Intel |
while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the... improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receiveLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Jul 2026
Staff Chemical Mechanical Planarization (cmp) Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Jul 2026
Staff Process Engineer, Dry Etch
Company: Intel |
while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the... improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive