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Packaging jobs in hillsboro USA

99 packaging jobs found in hillsboro: showing 1 - 50

Td Foundry Engineering Principle Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 25 Aug 2026
development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain
Qa/qc Cleanroom Technician
Company: MSR-FSR |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Aug 2026
, and packaging parts and assemblies received from high-tech manufacturing customers after being fed into the cleanroom
Production Team Member
Company: Gear Up Sports |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Aug 2026
product matches customer orders, packaging and preparing orders for shipment, and interacting with our shipping software
Import/export Logistics Coordinator
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$27 - 36 per hour | Date posted: 24 Aug 2026
and resolution of billing discrepancies. Coordinate with Warehouse on receiving, staging, packaging, and shipping priorities.... AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging
Hr Representative
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$70000 - 85000 per year | Date posted: 24 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Material Handler Ii - Weekend Night Shift
Company: GXO Logistics |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 21 Aug 2026
do on a typical day: Support operations by moving materials and inventory throughout the facility Construct packaging boxes and pick
Material Handler Ii - Weekend Day Shift
Company: GXO Logistics |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 21 Aug 2026
operations by moving materials and inventory throughout the facility Construct packaging boxes and pick merchandise Verify
Lead Data Center Inventory Control Specialist
Company: OVHcloud |

Location: Hillsboro, OR, USA

| Salary: US$38.46 - 48.07 per hour | Date posted: 20 Aug 2026
(transport, packing and packaging, etc.) Anticipate the end-of-life management of obsolete products and request the appropriate... without authorization from their manager, locking doors and lobbies, etc.) Manage shipments Prepare orders and packaging
Customer Engagement Applications Engineer (capres) – Usa
Company: KLA Corporation |

Location: Hillsboro, OR, USA

| Salary: US$102000 - 173400 per year | Date posted: 20 Aug 2026
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel
Low Yield Analysis Engineer On Shift
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$99030 - 139810 per year | Date posted: 19 Aug 2026
consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. - Respond to customers
Sr Mechanical Engineer - Cable & Harness Design -100% Remote (anywhere In The Us)
Company: Encore Semi |

Location: Hillsboro, OR, USA

| Salary: US$135000 - 160000 per year | Date posted: 19 Aug 2026
in electromechanical packaging, and proven experience working within rigorous Configuration Management (CM) workflows. Basic
Sr Mechanical Engineer – Cable & Harness Design -100% Remote (anywhere In The Us)
Company: Encore Semi |

Location: Hillsboro, OR, USA

| Salary: US$135000 - 160000 per year | Date posted: 19 Aug 2026
in electromechanical packaging, and proven experience working within rigorous Configuration Management (CM) workflows. Basic
Material Handler Ii - Weekend Night Shift
Company: GXO Logistics |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 19 Aug 2026
do on a typical day: Support operations by moving materials and inventory throughout the facility Construct packaging boxes and pick
Equipment Technician-nights
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$36 - 55 per hour | Date posted: 18 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Senior Procurement Specialist
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$75000 - 95000 per year | Date posted: 18 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Low Yield Analysis Engineer On Shift
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$99030 - 139810 per year | Date posted: 18 Aug 2026
consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. - Respond to customers
Custodian
Company: SBM Management |

Location: Hillsboro, OR, USA

| Salary: US$16.85 - 17.85 per hour | Date posted: 18 Aug 2026
, shipping and receiving, labeling, cleaning, recycling, packaging of special and hazardous waste. Operate motorized cleaning
Inventory Control Associate - Cycle Counting - Swing Shift
Company: Reser's Fine Foods |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 18 Aug 2026
promptly. 4. Ensures inventory variances are reconciled. 5. Balances the month-end inventory for raw packaging
Senior Density Fill Development Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 18 Aug 2026
packaging organizations (OSATs), integrated device manufacturers (IDMs), or EDA vendors, where they have contributed to physical
Vhe Forklift Driver - Swing Shift
Company: Reser's Fine Foods |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 18 Aug 2026
Description : General Summary: Transports packaging materials and finished products using a forklift or pallet jack... Principal Duties and Responsibilities 1. Transports finished products from the packaging line to the distribution center. 2
Warehouse Operator
Company: DSV |

Location: Hillsboro, OR, USA

| Salary: US$25 - 27 per hour | Date posted: 17 Aug 2026
by transporting, storing, packaging, re-packaging, processing and clearing all types of goods. We work every day from our many offices... in a logistics/distribution/relevant environment. Able to operate MHE with packaging and labeling experience Previous mechanical
Equipment Technician-nights
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$36 - 55 per hour | Date posted: 17 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Senior Procurement Specialist
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$75000 - 95000 per year | Date posted: 17 Aug 2026
technology, product design, and advanced packaging know-how to develop high performance power management solutions
Warehouse Operator
Company: DSV |

Location: Hillsboro, OR, USA

| Salary: US$25 - 27 per hour | Date posted: 17 Aug 2026
by transporting, storing, packaging, re-packaging, processing and clearing all types of goods. We work every day from our many offices... in a logistics/distribution/relevant environment. Able to operate MHE with packaging and labeling experience Previous mechanical
Senior Material & Logistics Coordinator
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$25 - 32 per hour | Date posted: 14 Aug 2026
on receiving, staging, packaging, and shipping priorities.Support logistics procedures, internal controls, root-cause... technology, product design, and advanced packaging know-how to develop high performance power management solutions
Production Control Coordinator
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$28 - 35 per hour | Date posted: 14 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Senior Physical Design Engineer - Neuromorphic Computing
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 14 Aug 2026
spanning chiplet and advanced packaging technologies. In this hands-on role, you will help overcome the performance, area... integration and/or advanced packaging. 1+ year of experience using AI tools for setting up tool flows, debugging and improving
Manufacturing Technical Specialist
Company: Actalent |

Location: Hillsboro, OR, USA

| Salary: US$22 - 28 per hour | Date posted: 14 Aug 2026
, packaging machines, and sterilization systems. Understanding of regulatory requirements associated with aseptic manufacturing..., packaging machines, and sterilization systems. The work involves regular review of technical and quality documentation
Senior Director - Supplier Quality And Reliability
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 13 Aug 2026
quality across wafer fabrication, advanced packaging, substrates, assembly, and test. The organization partners... quality incidents across wafer fabrication, advanced packaging, substrates, assembly, and test. This leader will partner
Senior Material & Logistics Coordinator
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$25 - 32 per hour | Date posted: 13 Aug 2026
discrepancies. Coordinate with Warehouse on receiving, staging, packaging, and shipping priorities. Support logistics procedures.... AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging
Production Control Coordinator
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$28 - 35 per hour | Date posted: 13 Aug 2026
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performance
Manufacturing Technical Specialist
Company: Actalent |

Location: Hillsboro, OR, USA

| Salary: US$22 - 28 per hour | Date posted: 13 Aug 2026
equipment and materials, such as isolators, filling, inspection, packaging machines, and sterilization systems. Understanding
Process Integration Engineer
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$95000 - 140000 per year | Date posted: 12 Aug 2026
by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high
Process Engineer - Thin Films
Company: Jireh Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$95000 - 120000 per year | Date posted: 12 Aug 2026
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management
Mixed Signal Logic Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 12 Aug 2026
with writing, testing, packaging and releasing firmware Experience writing, testing and supporting front-end automation... and packaging flows Experience using AI tools as a productivity booster in all aspects of the IP design process Strong analytical
Advanced Packaging Photolithography Development Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$133800 - 188890 per year | Date posted: 12 Aug 2026
Engineer to join our Advanced Packaging Technology Development team. In this role, you will be driving lithography process... development at the forefront of next-generation semiconductor packaging technology, including hybrid bonding applications
Lab Support Technician
Company: UST |

Location: Hillsboro, OR, USA

| Salary: US$48000 - 72000 per year | Date posted: 11 Aug 2026
lab support responsibilities including inventory management, decommissioning, dock operations, ticketing, packaging... operations: receiving, shipping, packaging, and manifest verification. Knowledge of ESD-safe handling procedures
Module Development Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$99030 - 139810 per year | Date posted: 11 Aug 2026
Job Details: Job Description: Microelectronic Packaging Collateral Engineers provide project management, equipment... concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events
Wpm C4 Quality And Reliability Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$120860 - 170630 per year | Date posted: 11 Aug 2026
to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide... network of manufacturing, advanced packaging, and assembly/test facilities. As a Quality and Reliability Engineer (QRE
Wpm C4 Quality And Reliability Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$89010 - 125660 per year | Date posted: 10 Aug 2026
to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide... network of manufacturing, advanced packaging, and assembly/test facilities. As a Quality and Reliability Engineer (QRE
Module Development Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$99030 - 162500 per year | Date posted: 10 Aug 2026
Job Details: Job Description: Module Packaging Media Engineers provide project management, media design/development... and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems
Process Engineer - Thin Films
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$95000 - 120000 per year | Date posted: 10 Aug 2026
. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging
Custodian
Company: SBM Management |

Location: Hillsboro, OR, USA

| Salary: US$16.85 - 17.85 per hour | Date posted: 10 Aug 2026
, shipping and receiving, labeling, cleaning, recycling, packaging of special and hazardous waste. Operate motorized cleaning
Process Integration Engineer
Company: Alpha & Omega Semiconductor |

Location: Hillsboro, OR, USA

| Salary: US$95000 per year | Date posted: 10 Aug 2026
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performance
Customer Engagement Applications Engineer - Sfs
Company: KLA Corporation |

Location: Hillsboro, OR, USA

| Salary: US$102000 - 173400 per year | Date posted: 08 Aug 2026
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel
Reginal Development Applications Engineer
Company: KLA Corporation |

Location: Hillsboro, OR, USA

| Salary: US$102000 - 173400 per year | Date posted: 08 Aug 2026
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., Platform Design, and Packaging Engineering, among others. Talent includes over 500 engineers across global centers in Israel
Regional Development Applications Engineer
Company: KLA Corporation |

Location: Hillsboro, OR, USA

| Salary: US$102000 - 173400 per year | Date posted: 07 Aug 2026
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., Platform Design, and Packaging Engineering, among others. Talent includes over 500 engineers across global centers in Israel
Applications Development Manager
Company: KLA Corporation |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 07 Aug 2026
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel
Quality Engineering Manager-assembly Packaging Testing Manufacturing
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 07 Aug 2026
Job Details: Job Description: The APTM (Assembly Packaging Testing Manufacturing) Quality Engineering Manager..., Hybrid bonding, Optical packaging, Silicon photonics and Assembly Test Development (ATD) processes, spanning Arizona, Oregon
Technical Director, Key Logic Account — Global Field Group (gfg)
Company: Applied Materials |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 06 Aug 2026
of a leading logic or advanced packaging process flow. Strong understanding of leading logic technologies and process flows...; advanced packaging experience preferred. Experience bundling or integrating value across multiple process technologies (e.g