Packaging jobs in hillsboro USA
104 packaging jobs found in hillsboro: showing 1 - 50
Aptm Npi Integrator
Company: Intel |
in integrating packaging processes with overall product manufacturing workflows. Package Design: Experience in designing packaging... process and packaging technology leadership for the AI era, enabling our customers to design leadership products, globalLocation: Hillsboro, OR, USA
| Salary: US$99030 - 188890 per year | Date posted: 04 Jun 2026
Senior Equipment Engineer (thin Films)
Company: Alpha & Omega Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$95000 per year | Date posted: 03 Jun 2026
Product Development Engineer
Company: Intel |
breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing... silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership productsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 03 Jun 2026
C&q And Material Manager - Contractor (hybrid Job)
Company: CIS International LLC |
) for Cascadia project test materials (for Filling, Inspection, Device Assembly, and Packaging processes) Maintain and update dates... confirmations with global and local packaging teams Coordinate with machine suppliers to confirm delivery timelines and trackLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 03 Jun 2026
Driver I (2nd Shift)
Company: Ultra Clean Technology |
products and supplies while ensuring packaging accuracy and compliance with company standards. This role supports production... and delivery operations by performing manual packaging tasks, conducting basic quality checks, and operating delivery vehiclesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 03 Jun 2026
Wla Yield Defect Metrology Engineer
Company: Intel |
and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale... and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assemblyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Jun 2026
Project Manager
Company: Peterson Holding Company |
. Coordinate all project logistics including equipment orders, custom packaging, shipping, and site services. Review contractLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Jun 2026
Principal Engineer, Hybrid Bonding Module
Company: Intel |
a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intel's leadership in high... advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performanceLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Jun 2026
Module Development Engineer
Company: Intel |
and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale... and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assemblyLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 02 Jun 2026
Senior Test Engineer
Company: Microsoft |
-functional partners. Support semiconductor IC development across fabrication, manufacturing test, and packaging phasesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Jun 2026
Mask Manufacturing Technician
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: US$51710 - 73010 per year | Date posted: 02 Jun 2026
Mask Manufacturing Technician
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: US$51710 - 73010 per year | Date posted: 02 Jun 2026
Mixed Signal Logic Design Engineer
Company: Intel |
with writing, testing, packaging and releasing firmware Experience writing, testing and supporting front-end automation... and packaging flows Experience using AI tools as a productivity booster in all aspects of the IP design process Strong analyticalLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Jun 2026
Supply Chain Engineer
Company: Intel |
manufacturing processes and advanced packaging technologies. Shape the future of semiconductor supply chain innovation by joining... while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for theLocation: Hillsboro, OR, USA
| Salary: US$140830 - 198820 per year | Date posted: 01 Jun 2026
Ltd Process Development Integration Engineer
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: US$85200 - 162500 per year | Date posted: 31 May 2026
Vhe Packager - Day Shift
Company: Reser's Fine Foods |
and Responsibilities 1. Checks for correct packaging boxes and containers. 2. Ensures product date and weight are within established... guidelines. 3. Seals filled product packages and boxes. 4. Examines containers, materials, and products to ensure packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 30 May 2026
Product Install Engineer (or) - Swift - 90% Travel
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$29.19 - 49.62 per hour | Date posted: 30 May 2026
Product Install Engineer (or) - Swift
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$29.19 - 49.62 per hour | Date posted: 30 May 2026
Procurement Coordinator
Company: Alpha & Omega Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$22 - 28 per hour | Date posted: 30 May 2026
Fabrication Support Specialist
Company: Avantor |
and ensure packaging meets regulatory and customer-specific requirements. Manage consigned, non-consigned, customer-ownedLocation: Hillsboro, OR, USA
| Salary: US$21 per hour | Date posted: 29 May 2026
Vhe Packager - Day Shift
Company: Reser's Fine Foods |
Principle Duties and Responsibilities 1. Checks for correct packaging boxes and containers. 2. Ensures product..., and products to ensure packaging meet company specifications. 5. Removes defective products or packages from the production lineLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 29 May 2026
Rf Engineer
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 29 May 2026
Senior Infrastructure And Devops Engineer
Company: Intel |
automation for build systems, toolchains, packaging, and dependency management. Enable scalable and reproducible executionLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 29 May 2026
Intel Foundry Module Development Engineer
Company: Intel |
and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale... and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assemblyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 May 2026
Manufacturing Engineer
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: US$52000 - 200000 per year | Date posted: 28 May 2026
Sr. Production Supervisor (3rd Shift)
Company: Ultra Clean Technology |
(chemical/manual) Coating and surface treatment Inspection, packaging, and shipment preparation Drive site performanceLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 May 2026
Ltd Frame Automation Software Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$95640 - 181940 per year | Date posted: 28 May 2026
Process Integration Development Engineer
Company: Intel |
cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 May 2026
Module Development Engineer
Company: Intel |
silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products..., global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the wayLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 May 2026
Module Development Engineer
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 May 2026
Module Development Engineer
Company: Intel |
silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products..., global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the wayLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 May 2026
Vhe - Pallet Puller - Day Shift
Company: Reser's Fine Foods |
Principle Duties and Responsibilities 1. Transports pallets from the packaging line to the distribution center. 2. Delivers... empty pallets to the production line. 3. Delivers packaging materials to the production line. 4. Wraps loaded palletsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 May 2026
Product Development Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... of semiconductors. Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon highLocation: Hillsboro, OR, USA
| Salary: US$100100 - 170200 per year | Date posted: 27 May 2026
Customer Engagement Applications Engineer (fast)
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 27 May 2026
Intel Foundry Module Development Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 May 2026
Intel Foundry Lithography Module Engineer
Company: Intel |
-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: US$89010 - 125660 per year | Date posted: 27 May 2026
Cdi Technician
Company: MSR-FSR |
and after final packaging according to MSR-FSR written procedures and quality standards within the Metrology Lab. The CDILocation: Hillsboro, OR, USA
| Salary: US$47800 - 52000 per year | Date posted: 26 May 2026
Intel Foundry Lithography Module Development Engineer
Company: Intel |
-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 26 May 2026
Wla Yield Defect Metrology Engineer
Company: Intel |
for everyone. Want to learn more? Visit our YouTube Channel or the link below. Advanced Packaging / TD is the heart and soul of Moore.... TDs more than 10,000 employees drive breakthrough research, develop next generation process and packaging technologiesLocation: Hillsboro, OR, USA
| Salary: US$99030 - 139810 per year | Date posted: 26 May 2026
Wla Yield Defect Metrology Engineer
Company: Intel |
for everyone. Want to learn more? Visit our YouTube Channel or the link below. Advanced Packaging / TD is the heart and soul of Moore.... TDs more than 10,000 employees drive breakthrough research, develop next generation process and packaging technologiesLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 25 May 2026
Quality Assurance Auditor
Company: Alpha & Omega Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$100000 - 125000 per year | Date posted: 22 May 2026
Module Development Engineer
Company: Intel |
development. Preferred Qualifications - Familiarity with semiconductor packaging and assembly technologies. - Demonstrated... manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packagingLocation: Hillsboro, OR, USA
| Salary: US$99030 - 188890 per year | Date posted: 21 May 2026
Quality Specialist - 2nd Shift
Company: GXO Logistics |
experience in manufacturing, packaging, or distribution facility This job requires the ability to: Lift up to 25 lbsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 21 May 2026
Senior Equipment Engineer (cmp/epi)
Company: Jireh Semiconductor |
. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packagingLocation: Hillsboro, OR, USA
| Salary: US$95000 - 130000 per year | Date posted: 20 May 2026
Senior Integration Engineer
Company: Jireh Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$95000 - 130000 per year | Date posted: 20 May 2026
Senior Equipment Engineer (thin Films)
Company: Jireh Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$90000 - 130000 per year | Date posted: 20 May 2026
Equipment Technician-nights
Company: Jireh Semiconductor |
itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging knowLocation: Hillsboro, OR, USA
| Salary: US$36 - 55 per hour | Date posted: 20 May 2026
Process Integration And Yield Technician
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: US$60450 - 99770 per year | Date posted: 19 May 2026
Vhe-packager-swing Shift
Company: Reser's Fine Foods |
Principle Duties and Responsibilities 1. Checks for correct packaging boxes and containers. 2. Ensures product..., and products to ensure packaging meet company specifications. 5. Removes defective products or packages from the production lineLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 19 May 2026
Module Development Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus