Packaging jobs in hillsboro USA
104 packaging jobs found in hillsboro: showing 51 - 100
Senior Process Engineer - Dry Etch
Company: Intel |
while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the... improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receiveLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 18 May 2026
Warehouse Technician
Company: NW Staffing |
of Packaging Machinery: Install, calibrate, and test packaging machinery at client locations. Perform routine maintenanceLocation: Hillsboro, OR, USA
| Salary: US$21 per hour | Date posted: 16 May 2026
Equipment Technician-nights
Company: Alpha & Omega Semiconductor |
itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging knowLocation: Hillsboro, OR, USA
| Salary: US$36 - 55 per hour | Date posted: 16 May 2026
Senior Equipment Engineer (cmp/epi)
Company: Alpha & Omega Semiconductor |
. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 16 May 2026
Senior Integration Engineer
Company: Alpha & Omega Semiconductor |
Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performanceLocation: Hillsboro, OR, USA
| Salary: US$95000 per year | Date posted: 16 May 2026
Senior Equipment Engineer (thin Films)
Company: Alpha & Omega Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$90000 per year | Date posted: 15 May 2026
Senior Testchip Soc Physical Design Engineer (integration & Methodology)
Company: Intel |
cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 May 2026
Project Manager 2
Company: Peterson Holding Company |
all project logistics including equipment orders, custom packaging, shipping, and site services. Review contract documentsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 May 2026
Senior Regional Development Application Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devicesLocation: Hillsboro, OR, USA
| Salary: US$119000 - 202300 per year | Date posted: 13 May 2026
Intel Foundry Process Td Frame Cellset Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 13 May 2026
Material Handler, Hillsboro
Company: Tosoh Quartz |
knowledge of shipping procedures, routes and rates; prepare materials for shipping by weighing, packaging and stamping; prepareLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 12 May 2026
Sr. Director Of Platform Program Management
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 11 May 2026
Director Of Central Supply Planning
Company: Intel |
, advanced packaging, back-end assembly/test, and finished good supply. This role is accountable for delivering a single, aligned... Packaging Planning (bump, sort, and wafer level assembly) Back-End Planning (assembly and test) Customer Order ManagementLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 11 May 2026
Process Integration Development Engineer
Company: Intel |
-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 10 May 2026
Warehouse Technician
Company: NW Staffing Resources |
components, and perform necessary adjustments to restore equipment functionality. Installation & Maintenance of Packaging... Machinery: Install, calibrate, and test packaging machinery at client locations. Perform routine maintenance and upgradesLocation: Hillsboro, OR, USA
| Salary: US$21 per hour | Date posted: 09 May 2026
System Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$115900 - 197000 per year | Date posted: 08 May 2026
Equipment Technician - Photo (nights)
Company: Jireh Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: US$28 - 45 per hour | Date posted: 06 May 2026
Customer Support Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$25.15 - 42.75 per hour | Date posted: 06 May 2026
Module Development Engineer
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 06 May 2026
Production Supervisor (3rd Shift)
Company: Ultra Clean Technology |
cleaning, coating, inspection, and packaging operations. Maintain active floor presence to ensure adherence to SOPs, qualityLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 05 May 2026
Design Technology Tool Enablement Engineer
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 05 May 2026
Infrastructure Engineer – Compute And Client
Company: Intel |
-- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design... leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packagingLocation: Hillsboro, OR, USA
| Salary: US$100550 - 166060 per year | Date posted: 05 May 2026
Equipment Technician - Photo (nights)
Company: Alpha & Omega Semiconductor |
semiconductor process technology, product design, and advanced packaging know-how to develop high performance power managementLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 05 May 2026
Analog/mixed-signal Design Engineer, Principal
Company: Marvell |
with a multidisciplinary team across photonics, system, packaging, and validation to deliver scalable, low-power, high-performance EICs... experts, such as digital/VLSI, AI/ML, Photonics, and packaging. Expected Base Pay Range (USDLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 May 2026
Fab Equipment Maintenance Commodity Manager
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$128080 - 180820 per year | Date posted: 29 Apr 2026
Aptm Advanced Packaging Dry Etch Development Manager
Company: Intel |
Job Details: Job Description: The Role and Impact Intel Foundry is seeking an exceptional Advanced Packaging Dry... Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutionsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 29 Apr 2026
Clean & Packaging Technician 1
Company: Acumed |
where everyones empowered to be their best. Job Scope The Clean & Packaging Technician is responsible for the cleaning, label printing..., and packaging of both non-sterile and sterile medical devices. Shift: Monday - Thursday 3:00pm - 1:30am ResponsibilitiesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 Apr 2026
Product Development Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Hillsboro, OR, USA
| Salary: US$80800 - 137400 per year | Date posted: 28 Apr 2026
Wet Etch Cleans Technical Manager
Company: Intel |
silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products..., global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the wayLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 28 Apr 2026
Customer Engagement Applications Engineer
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devicesLocation: Hillsboro, OR, USA
| Salary: US$83100 - 141300 per year | Date posted: 25 Apr 2026
Sales Account Manager
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... semiconductors, wafers, reticles, advanced packaging, process equipment and materials. Semi PC solves our customers most criticalLocation: Hillsboro, OR, USA
| Salary: US$129400 - 220000 per year | Date posted: 25 Apr 2026
Analytical Chemistry Lab Technician
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$63090 - 89060 per year | Date posted: 24 Apr 2026
Qubit Control Ic Designer
Company: Intel |
electronics for Intel quantum computers. The team is focused on leveraging the latest Intel CMOS processes, packaging... our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enablingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 24 Apr 2026
Soc Performance Architect
Company: Intel |
and quality delivered through the best mix of silicon, packaging and platform solutions. As a SOC Performance ArchitectLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 23 Apr 2026
Intel Contract - Facilities Water/waste Treatment Technician
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: US$52000 - 200000 per year | Date posted: 23 Apr 2026
Senior Pcb/cad Layout Engineer
Company: Intel |
technology, collaborating with world-class engineering teams across electrical design, packaging, manufacturing, thermalLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 23 Apr 2026
Inventory Control Associate - Reconciler - Swing Shift
Company: Reser's Fine Foods |
promptly. 4. Ensures inventory variances are reconciled. 5. Balances the month-end inventory for raw packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 19 Apr 2026
Foveros Direct Pathfinding Integration
Company: Intel |
-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology..., develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all typesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Apr 2026
Semiconductor Device Modeling Engineer
Company: Intel |
cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership... products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all theLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Apr 2026
Semiconductor Device Modeling Engineer
Company: Intel |
manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging... chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensureLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 14 Apr 2026
R&d Engineering, Sr Staff Engineer
Company: Synopsys |
of semiconductor design flows. Improving product reliability, scalability, and integration across Synopsys' IP packaging and subsystem... development and automation. The team focuses on integrated design flows for IP packaging and subsystem assembly. You'll workLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 14 Apr 2026
Qa/qc Cleanroom Technician
Company: MSR-FSR |
, and packaging parts and assemblies received from high-tech manufacturing customers after being fed into the cleanroomLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 13 Apr 2026
Physical Design Engineer - Neuromorphic Computing
Company: Intel |
qualifications: Experience in chiplet integration and/or advanced packaging. Static timing experience with multiple interfacesLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 13 Apr 2026
Quality Manager
Company: Intel |
and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale... and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assemblyLocation: Hillsboro, OR, USA
| Salary: US$118150 - 166800 per year | Date posted: 11 Apr 2026
Senior Yield Development Engineer - Intel Foundry
Company: Intel |
while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the... improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receiveLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 10 Apr 2026
Sr. Eda Tools Engineer - Esd
Company: Intel |
our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling... to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focusLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 09 Apr 2026
Process Integration Development Engineer
Company: Intel |
state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology..., through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundryLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 06 Apr 2026
Principal Engineer, Design Technology Co-optimization
Company: Intel |
is conducted across domains to guide silicon and packaging technology definition to maximize technology PPA entitlement... our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enablingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Apr 2026
Quality Engineering Manager-assembly Packaging Testing Manufacturing
Company: Intel |
Job Details: Job Description: The APTM (Assembly Packaging Testing Manufacturing) Quality Engineering Manager..., Hybrid bonding, Optical packaging, Silicon photonics and Assembly Test Development (ATD) processes, spanning Arizona, OregonLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 Mar 2026
Wla Yield Analysis Systems Eng
Company: Intel |
analysis software solutions in support of our aggressive advanced packaging roadmap. Responsibilities include..., but are not limited to: Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction