3D jobs in south burlington USA
20 3d jobs found in south burlington: showing 1 - 20
Civil/environmental Engineering Intern/co-op – Water (summer 2027)
Company: Stantec |
understanding of basic AutoCAD Civil 3D. REVIT experience is a plus. Strong interpersonal, verbal, and written communicationLocation: South Burlington, VT, USA
| Salary: US$23.47 - 34.5 per hour | Date posted: 25 Sep 2026
Dmts Siph Packaging & Assembly Materials
Company: GlobalFoundries |
2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on product and module reliability, package..., passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutionsLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 24 Sep 2026
Transportation Engineering Co-op/intern - Infrastructure (summer 2027)
Company: Stantec |
Office experience is a plus. Experience with AutoCAD and/or Civil 3D, MicroStation and/or OpenRoads Designer, ArcGISLocation: South Burlington, VT, USA
| Salary: US$23.47 - 34.5 per hour | Date posted: 21 Sep 2026
Smts Photonics Advanced Packaging Integration
Company: GlobalFoundries |
heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSVLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 19 Sep 2026
Dmts Siph Packaging & Assembly Materials
Company: GlobalFoundries |
leading Photonix platform growth into world class fully packaged electro -optical transceiver offerings utilizing 2.5D and 3D... V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including CopperLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 19 Sep 2026
Research Engineer In Bme
Company: University of Vermont |
) Experience with 3D printing and CAD design for custom hardware enclosures Familiarity with high-performance computingLocation: Burlington, VT, USA
| Salary: US$55000 - 60000 per year | Date posted: 18 Sep 2026
Principal Advanced Packaging Design Engineer
Company: Marvell |
configurations, including but not limited to 2.5D and 3D packages, co-packaged copper or optical solutions, and advanced substrates.... Understanding of advanced 2.5D and 3D packaging technologies, including: CoWoS-S/R/L EMIB CPO CPC Familiarity with toolsLocation: Burlington, VT, USA
| Salary: US$168400 - 249310 per year | Date posted: 17 Sep 2026
Fall 2027 Co-op - Quality Engineer
Company: Keurig Dr Pepper |
Data is preferred Experience with Solidworks and 3D printing is a plus Please Note: You must be work authorized in theLocation: Essex, VT, USA
| Salary: US$31 per hour | Date posted: 12 Sep 2026
Quantum 3dhi Engineer (2027 New College Graduate)
Company: GlobalFoundries |
will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding. Essential... and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. Develop expertise in theLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 12 Sep 2026
Principal 3d-heterogeneous Integration Engineer
Company: GlobalFoundries |
: GlobalFoundries is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D... Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains. Essential Responsibilities: Drive 3D-HILocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 11 Sep 2026
Advanced Packaging Intern, Bs - Summer 2027
Company: Marvell |
, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We workLocation: Burlington, VT, USA
| Salary: US$31 - 62 per hour | Date posted: 08 Sep 2026
Advanced Packaging Design Verification & Physical Validation Engineer
Company: Marvell |
requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate... Packaging Knowledge: Familiarity with advanced packaging technologies (e.g., 2.5D/3D IC, Chiplets, CoWoS, silicon interposersLocation: Burlington, VT, USA
| Salary: unspecified | Date posted: 02 Sep 2026
Design/sales Professional
Company: Bloom Partners Talent Solutions |
, and other industry-related computer programs Knowledge of plant material and uses in designs Create 2D & 3D designs that bring theLocation: Burlington, VT, USA
| Salary: US$115000 per year | Date posted: 13 Aug 2026
Civil Dam Project Engineer
Company: Scuttlebutt Services |
or Holyoke, Massachusetts office Ability to travel throughout New England. Preferred Experience With AutoCAD / Civil 3DLocation: South Burlington, VT, USA
| Salary: US$120000 - 150000 per year | Date posted: 13 Aug 2026
Senior Bridge Engineer
Company: Scuttlebutt Services |
3D experience Working knowledge of AASHTO Design GuidelinesLocation: South Burlington, VT, USA
| Salary: US$125000 - 175000 per year | Date posted: 13 Aug 2026
Civil & Environmental Project Manager
Company: Scuttlebutt Services |
management experience Experience with environmental permitting is a plus AutoCAD Civil 3DLocation: South Burlington, VT, USA
| Salary: US$90000 - 125000 per year | Date posted: 13 Aug 2026
Packaging Integration Engineer
Company: GlobalFoundries |
components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration). Perform...), pluggable modules, and silicon photonics ecosystems. Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPhLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 12 Aug 2026
Packaging Design Integration Engineer (2026 New College Graduate)
Company: GlobalFoundries |
platform and advanced 2.5D/3D packaging technologies. The engineer will contribute to thermal, mechanical, electrical.... Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration. Familiarity with DesignLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 08 Aug 2026
Packaging Integration Engineer (2026 New College Graduate)
Company: GlobalFoundries |
2.5D/3D packaging technologies. The engineer will contribute to package integration, process development, reliability.... Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration. Demonstrated priorLocation: Essex Junction, VT, USA
| Salary: unspecified | Date posted: 05 Aug 2026
Clinical Academic Breast Radiologist (assistant/associate/professor) - Radiology
Company: University of Vermont |
% of them with 3D tomosynthesis. There are 7 Hologic mammographic units; 4 at the 2 screening sites and 3 in our diagnostic... center. All units have Hologic 3D tomosynthesis and C-View. There are 4 GE Logic E-10 ultrasound units staffed by dedicated