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3D jobs in essex USA

14 3d jobs found in essex: showing 1 - 14

Civil/environmental Engineering Intern/co-op – Water (summer 2027)
Company: Stantec |

Location: South Burlington, VT, USA

| Salary: US$23.47 - 34.5 per hour | Date posted: 25 Sep 2026
understanding of basic AutoCAD Civil 3D. REVIT experience is a plus. Strong interpersonal, verbal, and written communication
Dmts Siph Packaging & Assembly Materials
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 24 Sep 2026
2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on product and module reliability, package..., passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions
Transportation Engineering Co-op/intern - Infrastructure (summer 2027)
Company: Stantec |

Location: South Burlington, VT, USA

| Salary: US$23.47 - 34.5 per hour | Date posted: 21 Sep 2026
Office experience is a plus. Experience with AutoCAD and/or Civil 3D, MicroStation and/or OpenRoads Designer, ArcGIS
Smts Photonics Advanced Packaging Integration
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 19 Sep 2026
heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV
Dmts Siph Packaging & Assembly Materials
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 19 Sep 2026
leading Photonix platform growth into world class fully packaged electro -optical transceiver offerings utilizing 2.5D and 3D... V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper
Fall 2027 Co-op - Quality Engineer
Company: Keurig Dr Pepper |

Location: Essex, VT, USA

| Salary: US$31 per hour | Date posted: 12 Sep 2026
Data is preferred Experience with Solidworks and 3D printing is a plus Please Note: You must be work authorized in the
Quantum 3dhi Engineer (2027 New College Graduate)
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 12 Sep 2026
will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding. Essential... and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. Develop expertise in the
Principal 3d-heterogeneous Integration Engineer
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 11 Sep 2026
: GlobalFoundries is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D... Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains. Essential Responsibilities: Drive 3D-HI
Civil Dam Project Engineer
Company: Scuttlebutt Services |

Location: South Burlington, VT, USA

| Salary: US$120000 - 150000 per year | Date posted: 13 Aug 2026
or Holyoke, Massachusetts office Ability to travel throughout New England. Preferred Experience With AutoCAD / Civil 3D
Senior Bridge Engineer
Company: Scuttlebutt Services |

Location: South Burlington, VT, USA

| Salary: US$125000 - 175000 per year | Date posted: 13 Aug 2026
3D experience Working knowledge of AASHTO Design Guidelines
Civil & Environmental Project Manager
Company: Scuttlebutt Services |

Location: South Burlington, VT, USA

| Salary: US$90000 - 125000 per year | Date posted: 13 Aug 2026
management experience Experience with environmental permitting is a plus AutoCAD Civil 3D
Packaging Integration Engineer
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 12 Aug 2026
components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration). Perform...), pluggable modules, and silicon photonics ecosystems. Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh
Packaging Design Integration Engineer (2026 New College Graduate)
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 08 Aug 2026
platform and advanced 2.5D/3D packaging technologies. The engineer will contribute to thermal, mechanical, electrical.... Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration. Familiarity with Design
Packaging Integration Engineer (2026 New College Graduate)
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 05 Aug 2026
2.5D/3D packaging technologies. The engineer will contribute to package integration, process development, reliability.... Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration. Demonstrated prior