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Thermal jobs in hillsboro USA

17 thermal jobs found in hillsboro: showing 1 - 17

Software Engineering Phd Intern New 2027
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$149598 - 149602 per year | Date posted: 02 Oct 2026
will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport... and thermal management, thin films development and patterning. The internship is designed for PhD students interested
Senior Thermal Validation Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 27 Sep 2026
Job Details: Job Description: The engineer is responsible for defining and executing silicon power and thermal... validation across Intel products. The role drives power and thermal optimization through workload analysis, characterization
Scientist Ii
Company: Adecco |

Location: Hillsboro, OR, USA

| Salary: US$31 - 35 per hour | Date posted: 25 Sep 2026
-voltage power supplies, low-current ammeters, ultra-high-vacuum systems, and other laboratory equipment. Perform thermal... experience in electron emission and high-vacuum technology Exposure to SEM/FIB, thermal imaging, data analysis, laboratory
Quantum Packaging Thermal Architect
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Sep 2026
Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal... development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling
Quantum Ic Package Substrate Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$122440 - 172860 per year | Date posted: 24 Sep 2026
), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design.... - Proficiency with understanding SI/PI/thermal impact on IC substrate design choices. Job Type: Experienced Hire Shift: Shift 1
Quantum Packaging Signal/power Integrity (si/pi) Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Sep 2026
, ADS, and related. - SI/PI/thermal impact on IC substrate design choices. - Design experience with large form factor IC
Quantum Interposer Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 23 Sep 2026
, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation
Quantum Qubit Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 23 Sep 2026
to create new customized EDA tool capability to enable thermal analysis of large scale quantum processors Implement PDK
Platform Hardware Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 18 Sep 2026
, thermal solutions, circuitry processes, packaging, and chassis for platform hardware. Collaborate with architects
Scientist Ii
Company: US Tech Solutions |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 16 Sep 2026
. We occasionally work with liquid nitrogen in cold experiments. Examples of experimental activities: Performing periodic thermal... Running computer simulations thermal transport, electrical transport, and/or electron emission Development, analysis
Module Engineering Phd Intern Summer 2027
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$120898 - 120902 per year | Date posted: 16 Sep 2026
(Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments
Material Handler/ Parts Runner - Installation Support
Company: WGNSTAR |

Location: Hillsboro, OR, USA

| Salary: US$22 - 30 per hour | Date posted: 15 Sep 2026
, chemical, mechanical, and thermal hazards Preferences: Fab experience preferred Technical certificate or associate degree
Material Handler/ Parts Runner - Installation Support
Company: WGNSTAR |

Location: Hillsboro, OR, USA

| Salary: US$22 - 30 per hour | Date posted: 15 Sep 2026
, chemical, mechanical, and thermal hazards Preferences: Fab experience preferred Technical certificate or associate degree
Sr. Co-op: Research & Development/ Digital (hillsboro, Or)
Company: Thermo Fisher Scientific |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 08 Sep 2026
SPC, statistical analysis, curve fitting, regression, image processing, and quantitative methods; model thermal/electrical
Lead Humanoid Robotics System Architect
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 30 Aug 2026
architecture requirements and drives the co-optimization of advanced AI models with physical hardware under tight power, thermal...: Author and maintain primary system-level specifications (compute, power, thermal, sensors, actuator networks, safety islands
Instrumentation & Controls Designer
Company: SSOE Group |

Location: Hillsboro, OR, USA

| Salary: US$80000 - 100000 per year | Date posted: 23 Aug 2026
arrangements and internal layouts, including terminal schedules, enclosure sizing, and thermal calculations. Generate I/O lists
Senior Hardware System Design Engineer
Company: Nvidia |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 01 Aug 2026
mechanical, power, and thermal aspects, and their interaction with at-scale datacenter deployment Hands-on experience solving