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Thermal jobs in hillsboro USA

23 thermal jobs found in hillsboro: showing 1 - 23

Supervisor, Manufacturing
Company: Thermo Fisher Scientific |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 21 Oct 2026
of manufacturing teams producing thermal field emitters used in electron microscopy. These products are manufactured in a cleanroom
Senior Soc Hw (power & Performance) Validation Engineer
Company: Microsoft |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 21 Oct 2026
-silicon Power & Performance validation strategy and execution, including performance, power, thermal, functional... requirements. Analyze performance, power, and thermal data to identify bottlenecks, regressions, and optimization opportunities
Senior Manager, Hardware Engineering
Company: Onto Innovation |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 21 Oct 2026
Precision motion assemblies Illumination and light source systems Environmental control and thermal management systems..., thermal analysis, and optical alignment strategies. Oversee prototype builds, design verification, system integration
Soc Hardware (power Management) Validation Engineer
Company: Microsoft |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 19 Oct 2026
strategies for power states, DVFS, idle and active power management, thermal management, performance-per-watt optimization... correlation activities across development milestones. Analyze power, performance, and thermal telemetry to identify bottlenecks
Android Aosp Sw Engineer
Company: Omega Solutions Inc |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 16 Oct 2026
management, graphics/display, input, media, and power or thermal behavior. Experience integrating Android with vendor BSPs... HAL, input, lights, thermal, and power HALs. Familiarity with Android compatibility and security validation such as CTS
Sort/test Quality & Reliability Engineer (qre)
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 13 Oct 2026
development, HVM transfer, and ATM excursion management Identify electrical, thermal, mechanical, contamination, ESD, and test... validation, and change control Electrical, thermal, mechanical, contamination, ESD, and test-induced product risk assessment
Senior Member Of Technical Staff, Thin Films Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 09 Oct 2026
film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal
Pre-si Power Performance Val & Opt Engineer (contract)
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$52000 - 200000 per year | Date posted: 08 Oct 2026
. Responsibilities will include but are not limited to: Develop and execute SoC-level power, thermal, and performance validation..., thermal, and performance meet competitive targets and specifications. Establish and execute methodologies for validating
Mechanical Design Engineer - Sustaining Support
Company: Ultra Clean Technology |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 07 Oct 2026
. Exposure to tolerance analysis, simple stress/thermal checks, or prototyping methods. Experience with PLM/ERP systems, ECO
Opto-mechanical Engineer Iv (e4)
Company: Applied Materials |

Location: Hillsboro, OR, USA

| Salary: US$128000 - 176000 per year | Date posted: 06 Oct 2026
intuition for thermal expansion behavior and appropriate tolerance ratios. Demonstrated ability to design for strength... for structural, thermal, modal or fluid problems, with evidence of correlating models to measured hardware. Structural-Thermal
Senior Cpu Silicon Analysis Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 04 Oct 2026
to characterize silicon behavior under a variety of operating conditions, workloads, and thermal/power envelopes Analyze
Software Engineering - Phd Intern
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$149598 - 149602 per year | Date posted: 02 Oct 2026
will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport... and thermal management, thin films development and patterning. The internship is designed for PhD students interested
Quantum Interposer Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Sep 2026
, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation
Quantum Packaging Thermal Architect
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 24 Sep 2026
Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal... development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling
Quantum Ic Package Substrate Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$122440 - 172860 per year | Date posted: 24 Sep 2026
), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design.... - Proficiency with understanding SI/PI/thermal impact on IC substrate design choices. Job Type: Experienced Hire Shift: Shift 1
Quantum Packaging Signal/power Integrity (si/pi) Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 23 Sep 2026
, ADS, and related. - SI/PI/thermal impact on IC substrate design choices. - Design experience with large form factor IC
Quantum Qubit Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 23 Sep 2026
to create new customized EDA tool capability to enable thermal analysis of large scale quantum processors Implement PDK
Platform Hardware Design Engineer
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 18 Sep 2026
, thermal solutions, circuitry processes, packaging, and chassis for platform hardware. Collaborate with architects
Module Engineering Phd Intern Summer 2027
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: US$120898 - 120902 per year | Date posted: 16 Sep 2026
(Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments
Sr. Co-op: Research & Development/ Digital (hillsboro, Or)
Company: Thermo Fisher Scientific |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 08 Sep 2026
SPC, statistical analysis, curve fitting, regression, image processing, and quantitative methods; model thermal/electrical
Lead Humanoid Robotics System Architect
Company: Intel |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 30 Aug 2026
architecture requirements and drives the co-optimization of advanced AI models with physical hardware under tight power, thermal...: Author and maintain primary system-level specifications (compute, power, thermal, sensors, actuator networks, safety islands
Instrumentation & Controls Designer
Company: SSOE Group |

Location: Hillsboro, OR, USA

| Salary: US$80000 - 100000 per year | Date posted: 23 Aug 2026
arrangements and internal layouts, including terminal schedules, enclosure sizing, and thermal calculations. Generate I/O lists
Senior Hardware System Design Engineer
Company: Nvidia |

Location: Hillsboro, OR, USA

| Salary: unspecified | Date posted: 01 Aug 2026
mechanical, power, and thermal aspects, and their interaction with at-scale datacenter deployment Hands-on experience solving