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Thermal jobs in durham USA

12 thermal jobs found in durham: showing 1 - 12

Mechanical Engineer/durham, North Carolina
Company: BD |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 02 Oct 2026
analysis (FEA) tools. Conduct detailed mechanical analysis, including stress, strain, and thermal analysis, to optimize
Remote Industrial Sales Manager
Company: Gables Search Group |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 30 Sep 2026
, an international leader in energy and thermal control systems. This role allows for full remote work within the US, providing the
Sales Manager - Industrial & Automation Solutions (remote - U.s.)
Company: Gables Search Group |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 30 Sep 2026
for our client, a global innovator in power and thermal management systems. This position is fully remote within the United States
Guest Service Coordinator Hospitality Ambassador
Company: Sauna House Durham |

Location: Durham, NC, USA

| Salary: US$17 per hour | Date posted: 24 Sep 2026
House, we've reimagined the ancient traditions of the thermal cycle for the modern world. We create intentional experiences... being asked Authentic enthusiasm for the thermal cycle and the Sauna House ritual Ownership mindset with a hospitality
Staff Engineer, Product Applications
Company: Analog Devices |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 22 Sep 2026
analyzers, spectrum analyzers, and thermal measurement tools, for validation and debugging of converter performance..., thermal issues, and control-loop instability. DE in technical documentation and communication, including preparation
Process Validation Engineer
Company: Katalyst HealthCares & Life Sciences |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 16 Sep 2026
of validation data and prepare technical summaries and validation reports. Support cleaning validation, SIP/CIP, thermal validation..., thermal validation, biologics manufacturing, PPQ/CPV, Minitab, or facility startup projects.
Hardware Engineering Intern, Phd, Summer 2027
Company: Google |

Location: Durham, NC, USA

| Salary: US$106000 - 141000 per year | Date posted: 14 Sep 2026
and power integrity, system validation, product design (mechanical/thermal), computer architecture, FPGAs, embedded systems..., or memory systems (FEA or CFD), modeling or simulation for power/thermal analysis, or prototyping, testing, and debugging
Hardware Engineering Intern, Bs/ms, Summer 2027
Company: Google |

Location: Durham, NC, USA

| Salary: US$86000 - 115000 per year | Date posted: 14 Sep 2026
(board design, board bring-up), signal and power integrity, system validation, product design (mechanical/thermal), computer... architecture, FPGAs, embedded systems, or memory systems (FEA or CFD), modeling or simulation for power/thermal analysis
Lead Engineer, Systems Applications – Power Solutions
Company: Analog Devices |

Location: Durham, NC, USA

| Salary: US$124721 - 180602 per year | Date posted: 28 Aug 2026
, telemetry, efficiency, thermal performance, EMI/EMC, reliability, and control. Translate customer and market requirements... preferred. Strong understanding of power conversion, distribution, protection, isolation, thermal trade-offs, transient
Senior Scientist, Formulation Science
Company: implaion |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 18 Aug 2026
of aggregation, thermal stability, viscosity, particulate risk, and protein higher-order structure Analyze samples and data
System Software Engineer – Data Center Compute Diagnostics
Company: Nvidia |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 01 Aug 2026
, PCIe and NVLink interfaces, power delivery, and thermal behavior. This role is well suited to an embedded, firmware, device... for compute engines, memory and cache subsystems, DMA engines, PCIe/NVLink interfaces, power, and thermal behavior
Business Development Manager- Emerging Growth Marketing
Company: Wolfspeed |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 22 Jul 2026
(2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal... management constraints in AI/HPC systems. Ability to communicate SiC's technical value proposition (thermal conductivity