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Thermal jobs in durham USA

7 thermal jobs found in durham: showing 1 - 7

Senior Field Application Engineer
Company: Nvidia |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 12 Dec 2024
for thermal management, power distribution, cabling, and rack layout as well as CPU Architecture knowledge The base salary...
Nuvotronics Sales And Marketing Manager
Company: Cubic |

Location: Durham, NC, USA

| Salary: $95000 - 152134 per year | Date posted: 05 Dec 2024
that offer: Ultra-low insertion loss Ultra-broadband, high-frequency performance Exceptional thermal management High isolation...
Staff Product Development Engineer
Company: Asensus Surgical |

Location: Durham, NC - Raleigh, NC, USA

| Salary: unspecified | Date posted: 23 Nov 2024
) Strong understanding and historical practice with thermal, vibration, and electromagnetic interference management of electromechanical...
Eda R&d Engineer With Emphasis On Simulation, Modeling, And Software Development
Company: Analog Devices |

Location: Durham, NC, USA

| Salary: $123500 - 169813 per year | Date posted: 20 Nov 2024
of circuits and systems; development of models to model thermal effects; or or development of automation to improve design...
Research & Development Engineer I
Company: Duke University |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 15 Nov 2024
Resonance, microscopes, gel imagers, plate readers, thermal cyclers, microfermenters, incubators, and others related...
3d Heterogeneous Integration Development Engineer (semiconductors)
Company: Micross Components |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 08 Nov 2024
, wafer thinning & handle wafer processes, thermal compression bonding, etc. 3D microstructure fabrication, including...
3d Heterogeneous Integration Development Engineer (semiconductors)
Company: Micross Components |

Location: Durham, NC, USA

| Salary: unspecified | Date posted: 07 Nov 2024
processes, thermal compression bonding, etc. 3D microstructure fabrication, including monolithic fabrication on device wafers...