Sem Engineer jobs in hillsboro USA
16 sem engineer jobs found in hillsboro: showing 1 - 16
Applications Engineer Ii (mad-sn-or)
Company: Hitachi Digital Services |
Job Description: POSITION: Applications Engineer II DIVISION: Metrology and Analysis Systems Division (MAD) COMPANY: Hitachi High-Tech... Applications Engineer II (AE) is responsible for technical product support with a focus on failure analysis (FA) of semiconductorLocation: Hillsboro, OR, USA
| Salary: US$110089 - 151373 per year | Date posted: 09 Oct 2026
Senior Engineer, Product Improvement Engineering
Company: Entegris |
Job Title: Senior Engineer, Product Improvement Engineering Job Description: The Role Entegris is seeking... a Product Improvement Engineer (PIE) in our Hillsboro, OR location to lead technical problem solving and continuous improvementLocation: Hillsboro, OR, USA
| Salary: US$90000 - 120000 per year | Date posted: 09 Oct 2026
Senior Yield Control Technology Engineer(mad-mt-or)
Company: Hitachi Digital Services |
Job Description: POSITION: Senior Yield Control Technology Engineer DIVISION: Metrology and Analysis Systems Division (MAD) COMPANY: Hitachi.... POSITION SUMMARY The Senior Yield Control Technology Engineer (SYCTE) is responsible for the technical leadership of productLocation: Hillsboro, OR, USA
| Salary: US$134476 - 184905 per year | Date posted: 09 Oct 2026
Product Failure Analysis Engineer - Scan Design For Test
Company: Intel |
where everyone can do their best work. We are seeking an experienced Product Failure Analysis Engineer - SCAN Design for Test who... diagnosis techniques (ATPG, scan diagnosis, fault isolation) and physical failure analysis methodologies (FIB, SEM, TEM, laserLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 07 Oct 2026
(epi) - Module Development Engineer - (phd Intern)
Company: Intel |
and throughput. Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM. Contribute... in materials and physical device characterization techniques, such as SEM or TEM, gained through coursework, academic researchLocation: Hillsboro, OR, USA
| Salary: US$120898 - 120902 per year | Date posted: 07 Oct 2026
Process Integration Development Engineer - Td Defect Metrology
Company: Intel |
Engineer, you will play a pivotal role in advancing semiconductor technology by designing, executing, and analyzing experiments... industry experience. Experience in materials characterization techniques such as SEM, TEM, Spectroscopy or other metrologyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 24 Sep 2026
Mechanical Engineer Ii – Engineering Change Leader
Company: Thermo Fisher Scientific |
find cures for cancer. Join Thermo Fisher Scientific as an Engineer II, Validation (Engineering Change Leader... electron microscopes (SEM), transmission electron microscopes (TEM), focused ion beam systems or related electron microscopyLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 22 Sep 2026
Low Yield Analysis Engineer On Shift
Company: Intel |
-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout..., integration and both internal and external customers in a collaborative environment. As an LYA Engineer, you will set prioritiesLocation: Hillsboro, OR, USA
| Salary: US$99030 - 139810 per year | Date posted: 20 Sep 2026
Low Yield Analysis Engineer On Shift
Company: Intel |
-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout..., integration and both internal and external customers in a collaborative environment. As an LYA Engineer, you will set prioritiesLocation: Hillsboro, OR, USA
| Salary: US$99030 - 139810 per year | Date posted: 20 Sep 2026
Module Development Engineer
Company: Intel |
Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques..., etc.) Design of experiments Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductorLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 18 Sep 2026
Module Development Engineer - Ltd Dry Etch
Company: Intel |
characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation. Expertise in APC developmentLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 13 Sep 2026
Customer Engagement Applications Engineer
Company: KLA Corporation |
and accurately. As an Applications Engineer, youll work closely with customers and multi-functional teams to maintain and optimize... fabrication or equivalent educational experience Minimum 2 years of hands-on SEM review, SEM inspection, or TEM/FIB experienceLocation: Hillsboro, OR, USA
| Salary: US$83100 - 141300 per year | Date posted: 12 Sep 2026
Semiconductor Research Integration Engineer
Company: Intel |
Engineer, you will drive cutting edge design, simulation, development, and implementation activities for scientific research... - Semiconductor research process integration engineer with a strong understanding of CMOS device physics, thin films, and modernLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 09 Sep 2026
Onsite Service Engineer (electron Microscopy) - Hillsboro, Or
Company: Thermo Fisher Scientific |
for an experienced service engineer wanting to be involved with a team with varied strengths and exposed to a constant variety... tools such as SEM, TEM, FIB, or similar systems. High School Diploma or GED equivalent required A detailed understandingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 31 Aug 2026
Yield Control Technology Engineer Ii Or Senior (mad-as-or)
Company: Hitachi Digital Services |
The Yield Control Technology Engineer II (YCTE) is responsible for the technical product support for CD-SEM sales... Job Description: POSITION: Yield Control Technology Engineer II -- or -- Senior Yield Control Technology Engineer (YCTE) DIVISION: MetrologyLocation: Hillsboro, OR, USA
| Salary: US$121673 - 167301 per year | Date posted: 23 Aug 2026
Thin Films Module Development Engineer
Company: Intel |
, or Cu interconnect barrier/liner/plating Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM