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Floor Layer jobs in tempe USA

5 floor layer jobs found in tempe: showing 1 - 5

Package Layout Design Engineer , Annapurna Labs - Ai Silicon Packaging
Company: Amazon |

Location: Tempe, AZ, USA

| Salary: unspecified | Date posted: 19 Sep 2026
center ASICs. In this role, you will execute package layout tasks from floor planning through tape out and manufacturing... design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release
Crew Lead - Data Center Services
Company: IES Communications |

Location: Tempe, AZ, USA

| Salary: US$30 per hour | Date posted: 08 Sep 2026
, shipping and RMA processing support as/when required Provide general cleaning on raised floor, cabinet/rack exterior surfaces..., work benches and other areas as needed on a weekly basis Troubleshooting layer-1 suspected cable plant issues Networking
Crew Lead - Data Center Services
Company: IES Communications |

Location: Tempe, AZ, USA

| Salary: US$30 per hour | Date posted: 08 Sep 2026
, shipping and RMA processing support as/when required Provide general cleaning on raised floor, cabinet/rack exterior surfaces..., work benches and other areas as needed on a weekly basis Troubleshooting layer-1 suspected cable plant issues Networking
Project Lead - Data Center Services
Company: IES Communications |

Location: Tempe, AZ, USA

| Salary: US$34 per hour | Date posted: 04 Sep 2026
, shipping and RMA processing support as/when required Provide general cleaning on raised floor, cabinet/rack exterior surfaces..., work benches and other areas as needed on a weekly basis Troubleshooting layer-1 suspected cable plant issues Networking
Sr. Package Layout Engineer, Annapurna Labs - Ai Silicon Packaging
Company: Amazon |

Location: Tempe, AZ, USA

| Salary: unspecified | Date posted: 29 Aug 2026
, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical... job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate