3D jobs in hillsboro USA
15 3d jobs found in hillsboro: showing 1 - 15
Applications Development Engineer
Company: KLA Corporation |
applications including: Logic (e.g., HKMG, FinFET/GAA) Memory (DRAM, 3D NAND) Advanced packaging (e.g., film stacksLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 04 Aug 2026
Floor Staff
Company: Regal Group |
and coupons Up selling/suggestive selling of Premium Viewing Experience (3D, RPX, IMAX). Promoting the Regal Crown Club programLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 02 Aug 2026
Lead, Engineer – Fab Technology, Surface Preparation And Integration (spi)
Company: Entegris |
process development in advanced wafer fab environment (Advanced Logic or Memory Vertical/3D architecture) or a semiconductorLocation: Hillsboro, OR, USA
| Salary: US$120000 - 150000 per year | Date posted: 28 Jul 2026
Mechanical / Process Designer
Company: HKA Enterprises |
semiconductor manufacturing facility in Hillsboro, OR. You'll produce detailed 2D/3D drawing packages, draft P&IDs, piping layoutsLocation: Hillsboro, OR, USA
| Salary: US$35.58 per hour | Date posted: 18 Jul 2026
Mechanical / Process Designer
Company: HKA Enterprises |
semiconductor manufacturing facility in Hillsboro, OR. You'll produce detailed 2D/3D drawing packages, draft P&IDs, piping layoutsLocation: Hillsboro, OR, USA
| Salary: US$35.58 per hour | Date posted: 17 Jul 2026
Mechanical Design Technician Career Level
Company: Apidel Technologies |
of field observations and field verifications to current systems. Youll leverage tools like AutoCAD/REVIT for detailed 2D/3DLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 17 Jul 2026
Mechanical / Process Designer (hybrid)
Company: On-Board |
verifications to current systems. Youll leverage tools like AutoCAD/REVIT for detailed 2D/3D drawing packages that bringLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 17 Jul 2026
Mechanical/process Designer
Company: Solvenow Inc. |
of field observations and field verifications to current systems. You'll leverage tools like AutoCAD/REVIT for detailed 2D/3DLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Senior Ic Packaging Engineer
Company: Microsoft |
for chiplet architecture with advanced 2.5D/3D packaging. Drive 2.5D/3D packaging product designs (bridge/interposer/substrate... management or quality management Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3DLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Advanced Packaging Dry Etch Module Development Engineer
Company: Intel |
processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packagingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 06 Jul 2026
Applications Development Engineer
Company: KLA Corporation |
, FinFET/GAA) Memory (DRAM, 3D NAND) Advanced packaging (e.g., film stacks, redistribution layers) Assist in developing newLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 02 Jul 2026
3d Memory Chip Architect And Design, Principal Engineer
Company: Qualcomm |
- and this is where you come in. The Qualcomm Custom Memory Team in Process & Package Solutions Group has an opening in the areas of 3D Memory Design... the 3D Memory architectures to improve system KPIs such as bandwidth, latency, power, thermal, and area efficiency. TheLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 26 Jun 2026
Electrical Project Engineer - Global Construction Engineering
Company: Intel |
Engineer status. Familiarity with: Reading and interpreting construction contract documents. 1-line diagrams and BIM (3DLocation: Hillsboro, OR, USA
| Salary: US$118150 - 166800 per year | Date posted: 25 Jun 2026
Staff Product Development Engineer - Hand & Upper Extremity
Company: Acumed |
, and products; ability to independently develop solutions and intellectual property; proficiency with 3D/2D CAD software, GeometricLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 18 Jun 2026
Principal Engineer, Hybrid Bonding Module
Company: Intel |
with advanced packaging flows (chiplets, 2.5D/3D integration) and with equipment-process co-optimization and supplier engagement