find the right job for you in USA


Processing jobs in essex USA

57 processing jobs found in essex: showing 51 - 57

Pharmacy Operations Manager
Company: Walgreens |

Location: South Burlington, VT, USA

| Salary: US$22.5 - 31 per hour | Date posted: 21 Apr 2026
in relation to pharmacy errors and the Continuous Quality Improvement Program. Ensures the accurate processing of insurance
Fab 9 Technology Development Gan Epitaxial Engineer
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 17 Apr 2026
processing of wafer lots to meet program schedules. Perform and evaluate experiments using multiple techniques and failure
Principal Engineer - Integration Engineering
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 17 Apr 2026
product quality, reducing defectivity, improving process stability (Cp/Cpk), and increasing processing efficiency Detect... of coding languages R or Python Lab or pre-professional experience in semiconductor processing Understanding and knowledge
Sr. Equipment Engineer - Diffusion
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 14 Apr 2026
working with electrical and mechanical components Preferred Qualifications: Knowledge of semiconductor/silicon processing
Staff Technician Equipment Engineering
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 08 Apr 2026
and knowledge of semiconductor processing and process equipment Proven strong technical writing skills Proven training skills
Pharmacy Intern Grad
Company: Walgreens |

Location: South Burlington, VT, USA

| Salary: unspecified | Date posted: 04 Apr 2026
. Proposes and implements enhancements to pharmacy systems to further promote productivity. Ensures the accurate processing
Smts - 3d Heterogenous Integration Engineer - 2.5d Interposer/bridge/dtc
Company: GlobalFoundries |

Location: Essex Junction, VT, USA

| Salary: unspecified | Date posted: 01 Apr 2026
, including RDL/UBM metallization, wafer thinning/backside processing, wafer test/probe, OSAT collaboration, and package