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Physics jobs in boise USA

127 physics jobs found in boise: showing 51 - 100

Principal Engineer, Adv Dram Pi
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 11 May 2026
and manufacturability of next-generation 3D DRAM. This role bridges the gap between device physics, materials science, and process... in Physics, Materials Science, Electrical Engineering, or a related technical field. 5+ years of relevant industry experience
Staff Engineer, Adv Dram Pi
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 11 May 2026
of memory scaling! This role bridges the gap between device physics, materials science, and process integration to solve.... Minimum Qualifications MS or PhD in Physics, Materials Science, Electrical Engineering, or a related technical field. 3
Advanced Dram Process Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 10 May 2026
. As a Pathfinding Device Integration Engineer, you will work at the groundbreaking edge of memory innovation, applying device physics... improvements. Apply a deep understanding of semiconductor device physics and first-principles analysis to guide design trade-offs
Principal Product Yield Analysis Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 May 2026
, Electronics, Photonics, Materials Science & Engineering, Applied Physics, Computer Engineering, or equivalent. 5+ years
Films Process Development Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 08 May 2026
Strong foundation in materials science, chemical reaction engineering, and thin film physics Handson experience with EUV patterning
Principal Process Engineer, Die Bonding
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 May 2026
in Engineering, Physics, or related field Experience in working on Die Bonding : Fusion Bonding, Hybrid Bonding, Direct Bonding
New College Grad - Pathfinding Device Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 May 2026
next-generation semiconductor device technologies. In this role, you will work at the intersection of device physics, materials... physics and first-principles analysis to guide technology development and design trade-offs. Serve as an integration owner
Td Photolithography Automation Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 06 May 2026
s degree in engineering, Physics, or a lithography-related field plus 5 years of relevant experience, or MS/PhD plus 2 years
Pathfinding Device Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 06 May 2026
to enable whats next! As a Pathfinding Device Integration Engineer, you will work at the intersection of device physics... Engineering, Materials Science, Applied Physics, or a related field. Strong foundation in semiconductor device physics
Dram Process Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 06 May 2026
a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling... physics. You have strong understanding of semiconductor process integration and process development. You are very familiar
Td Thin Films Process Development Engineer Dram
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 06 May 2026
to resolve feasibility issues before they impact production. ## ## Minimum Qualifications: Masters degree in Physics
New College Grad - Engineer, Surface Lab
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 05 May 2026
Science, Physics, Chemistry, or a closely related field Handson laboratory experience with scientific or engineering
Module Process Engineer Iv - (e4) - Dielectric Deposition (cvd / Ald)
Company: Applied Materials |

Location: Boise, ID, USA

| Salary: US$116000 - 159500 per year | Date posted: 05 May 2026
, Physics, or Chemistry (or equivalent). 7+ years of experience in dielectric deposition process engineering. Strong Wafer
Pathfinding Device Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 04 May 2026
and reliability improvements. Apply deep semiconductor device physics knowledge to guide technology development and design trade-offs... audiences. ## ## Minimum Qualifications PhD or MS in Electrical Engineering, Materials Science, Applied Physics
Module Process Engineer Iv - (e4) – Plasma Etch
Company: Applied Materials |

Location: Boise, ID, USA

| Salary: US$116000 - 159500 per year | Date posted: 04 May 2026
stakeholders, often at senior levels, to adopt new approaches or solutions. Qualifications BS in Engineering, Physics
Principal Equipment Development Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 29 Apr 2026
, Physics, or a related field 10+ years of experience in semiconductor equipment engineering, advanced packaging, or technology
Process Integration Engineer | Aptd
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 29 Apr 2026
semiconductor industry. MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry
Senior Product Engineer (adv Pkg Pathfinding), Heterogeneous Integration Group (hig), High Bandwidth Memory (hbm)
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 29 Apr 2026
, Physics, Materials, or related field Proven track record in semiconductor industry Deep knowledge of sophisticated
R & D Electrical Device Characterization Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 28 Apr 2026
in Electrical Engineering, or related field. Position requires: 1\. Semiconductor device physics, electrical characterization
Process Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 28 Apr 2026
, reduction of cost, and quality improvement; 4\. Semiconductor device physics - transistor operations, scaling limitations
Ram Shift Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 28 Apr 2026
's degree in Physics, Chemical Engineering, or related field. Position requires: 1\. STEM principles including calculus-based... Physics 2\. Data Science and Data Manipulation (scripting, coding, programming, Python, JMP, or SQL) 3\. Writing engineering
Sr. Applications Engineer
Company: Axcelis Technologies |

Location: Boise, ID, USA

| Salary: US$126639.2 - 189958.8 per year | Date posted: 26 Apr 2026
or Diffusion physics Beam optics Dosimetry systems Vacuum technology Temperature measurement systems Semiconductor... fabrication and device physics Clean room protocols and wafer processing Implant chemical analysis techniques Implant
Senior Field Applications Engineer
Company: PDF Solutions |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 26 Apr 2026
: Job Requirements: Minimum Master's degree or minimum 2 years of field experience Degree in Electrical Engineering, Applied Physics
Staff Equipment Development Engineer - Advanced Packaging
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 25 Apr 2026
, Physics, or other related technical fields 2+ years of semiconductor process or equipment engineering experience
Sr Process Integration Engineer, Dram
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 24 Apr 2026
. This will require a strong background in materials science and semiconductor device physics, along with a creative mindset... Engineering, Physics, or other related technical field is required, plus 3 years of demonstrated semiconductor industry experience
Field Process Engineer 5
Company: Lam Research |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 24 Apr 2026
in systems and applications. ## Who were looking for Minimum Qualifications: PhD in Electronics, Chemistry, Physics
Equipment Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 24 Apr 2026
learning/JMP Scripting; 4\. Process flow related to area equipment and SPC principles; and 5\. Physics, area chemistry
Staff Engineer, Metals Implant Dram
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 Apr 2026
.D. in Materials Science, Chemistry, Physics, Chemical Engineering or a related field. Position requires: 1\. Chemical Vapor
Field Process Engineer 3
Company: Lam Research |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 Apr 2026
: PhD in Electronics, Chemistry, Physics, Material Science, or related field; or Masters of Science with 3+ years
Staff Product Engineer (adv Pkg Pathfinding), Heterogeneous Integration Group(hig), High Bandwidth Memory (hbm)
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 22 Apr 2026
. Minimum Qualifications: Bachelors/Masters/Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics
Front End Central Product Integration Engineer – Test & Product Yield Integration (senior / Staff / Principal)
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 22 Apr 2026
in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field. 2+ years of experience... of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing. Proven ability in data
Frontend Central Process Integration Senior Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 22 Apr 2026
in Electrical Engineering, Materials Engineering, Materials Science, Physics, or Chemical Engineering. Strong logical thinking
Principal Tcad Device Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 18 Apr 2026
intersection of physics, process integration, and design, using advanced modeling and simulation to influence real silicon... Qualifications: PhD in Electrical Engineering or Physics with 2 years of semiconductor industry experience, or MS with 4 years
Engineer, Cvd/diff Dram
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 Apr 2026
fundamentals, reaction kinetics, and device physics to design, qualify, and scale thin film processes that deliver superior... a Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science and Engineering, Physics, Chemistry
Semiconductor Process Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 Apr 2026
management 5\. Physics, area chemistry, and algebraic concepts Job Profile(s): Semiconductor Process Engineer 3
Engineer-metrology Process
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 16 Apr 2026
Minimum Qualifications: Bachelors degree in engineering, physics, materials science, or equivalent practical experience 2
Sr Beol Engineer - Dram Process Integration
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 15 Apr 2026
, Microelectronics, Physics, Chemistry, or related field along with coursework or research in thin films, interconnect technology
Dram Process Integration Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 14 Apr 2026
a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling..., etc. acquired through significant proven contributions. You are an expert in semiconductor device physics
Principal Engineer Advanced Package Technology Development
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 13 Apr 2026
. BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field
Process Integration Lead, Aptd
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 11 Apr 2026
, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating seniorlevel technical
Process Integration Engineer | Aptd
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 11 Apr 2026
, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating seniorlevel technical
Senior/principal Dry Etch Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 11 Apr 2026
of plasma physics, transport or surface phenomena gained through experience and/or coursework. High aspect ratio Dry Etch... in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, or other related
Staff Engineer, Aptd Backgrind/edge Trim
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 Apr 2026
findings into actionable process or technology improvements. Strong analytical, physicsbased, and creative problemsolving
Process Integration Operation Support Technician
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 Apr 2026
in Electrical Engineering, Physics, Chemistry, Materials Science, or a related technical field Preferred Qualifications: Prior
Senior Metrology Applications Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 Apr 2026
s degree in Engineering, Physics, Chemistry, Material Science, or related field and 2 years of experience in the job offered
Semiconductor Process Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 Apr 2026
objectives. May telecommute part-time. Employer will accept a Bachelors degree in Engineering, Chemistry, Physics or related
Thin Films Advanced Dram Process Development Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 Apr 2026
solving Minimum Qualifications: Masters degree with 2+ years of experience in Physics, Chemistry, Chemical Engineering
Thin Films Advanced Dram Process Development (open)
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 Apr 2026
solving Minimum Qualifications: Masters degree with 2+ years of experience in Physics, Chemistry, Chemical Engineering
Process Integration Lead, Aptd
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 Apr 2026
, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating seniorlevel technical
Staff Engineer, Cmp Process Development R&d
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 Apr 2026
) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related