Packaging jobs in ann arbor USA
58 packaging jobs found in ann arbor: showing 51 - 58
Sr. Algorithm Engineer (image Processing)
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$105900 - 180000 per year | Date posted: 07 Jul 2026
Spares Field Demand Planner
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$77800 - 132300 per year | Date posted: 07 Jul 2026
Engineering Technician
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel..., Platform Design, and Packaging Engineering, among others. Talent includes over 500 engineers across global centers in IsraelLocation: Ann Arbor, MI, USA
| Salary: US$26.98 - 45.87 per hour | Date posted: 02 Jul 2026
Program Manager - Global Trade Initiatives
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$128100 - 217800 per year | Date posted: 30 Jun 2026
Spares Demand Planner
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$51100 - 86900 per year | Date posted: 27 Jun 2026
Sr. Software Engineer - Ai/ml
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$129600 - 220300 per year | Date posted: 24 Jun 2026
Senior Systems Software Engineer (c++)
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panelLocation: Ann Arbor, MI, USA
| Salary: US$129600 - 220300 per year | Date posted: 17 Jun 2026
Hpc / Ai Software Infrastructure Lead (e)
Company: KLA Corporation |
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel