Integration jobs in hillsboro USA
133 integration jobs found in hillsboro: showing 101 - 133
Wireless Protocol Engineer Co-op (winter Spring 2027)
Company: Skyworks |
for firmware design and implementation. Support integration and validation of firmware in system-level environments. ContributeLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 Aug 2026
Embedded Firmware Engineer Co-op (winter/spring 2027)
Company: Skyworks |
for firmware design and implementation. Support integration and validation of firmware in system-level environments. ContributeLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 27 Aug 2026
Wireless Protocol Engineer Co-op (winter Spring 2027)
Company: Skyworks |
for firmware design and implementation. Support integration and validation of firmware in system-level environments. ContributeLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 26 Aug 2026
Embedded Firmware Engineer Co-op (winter/spring 2027)
Company: Skyworks |
documentation for firmware design and implementation. Support integration and validation of firmware in system-level environmentsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 26 Aug 2026
Thin Films Module Development Engineer
Company: Intel |
including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers Contribute... assessment, process screening, integration development, and silicon validation Qualifications: Minimum qualificationsLocation: Hillsboro, OR, USA
| Salary: US$133800 - 188890 per year | Date posted: 23 Aug 2026
Bns Senior Vice President Of Networks & General Manager
Company: Bold New Solutions - BNS Power |
performance across 24/7/365 operations, remote and smart hands, and preventive maintenance programs, with ITSM integration... and partnership targets that add capability, capacity, or geographic reach, and lead post-close integration into the BNS operatingLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 22 Aug 2026
Technician Iii (electrical Assembly 1st Shift)
Company: Ultra Clean Technology |
advanced electrical assembly, wiring, and integration of components, harnesses, panels, and systems. Interpret and workLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 21 Aug 2026
Technician Iii (electrical Assembly 1st Shift)
Company: Ultra Clean Technology |
advanced electrical assembly, wiring, and integration of components, harnesses, panels, and systems. Interpret and workLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 21 Aug 2026
Customer Engagement Applications Engineer (capres) – Usa
Company: KLA Corporation |
, application ramp, and process integration Provide hands-on support at customer sites, including recipe setup, optimizationLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 21 Aug 2026
Technician Iii (electrical Assembly 1st Shift)
Company: Ultra Clean Technology |
advanced electrical assembly, wiring, and integration of components, harnesses, panels, and systems. Interpret and workLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 21 Aug 2026
Technician Iii (electrical Assembly 1st Shift)
Company: Ultra Clean Technology |
advanced electrical assembly, wiring, and integration of components, harnesses, panels, and systems. Interpret and workLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 20 Aug 2026
Cpu Design Methodology Engineer
Company: Nvidia |
design automation, RTL integration, and chip build and assembly. You should be passionate about developing methodologies... design, specializing in SOC integration and design automation Excellent analytical and problem-solving skills ExperienceLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 19 Aug 2026
Senior Development Engineer - Density Fill
Company: Intel |
to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancementsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 18 Aug 2026
Module Development Engineer - Cmp
Company: Intel |
and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutionsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 17 Aug 2026
Product Test Engineer
Company: Lattice Semiconductor |
Experience in ATE test program development, integration and debug on Nextest Magnum, Advantest T2K or Teradyne UltraFLEXLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 17 Aug 2026
Senior Middleware Software Development Engineer
Company: Intel |
-hardware integration for maximum performance Performance Optimization and Analysis Develop performance optimizationsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 16 Aug 2026
Process Engineer I-v
Company: Hitachi Digital Services |
specifications, performance targets, and device integration requirements. The Productivity Team supports the ramp of advanced highLocation: Hillsboro, OR, USA
| Salary: US$66756 - 184905 per year | Date posted: 14 Aug 2026
Technical Lead, Data Center It Operations
Company: OVHcloud |
: $33.50- $38.50 per hour (based on relevant experience). Essential Duties & Responsibilities Oversee the development, integrationLocation: Hillsboro, OR, USA
| Salary: US$33.5 - 38.5 per hour | Date posted: 12 Aug 2026
Technical Director, Key Logic Account — Global Field Group (gfg)
Company: Applied Materials |
supporting internal teams on deep technical issues (integration or unit process), mentoring engineers, and fostering... equipment process engineering, wafer fab process engineering, or wafer fab process integration within a technology developmentLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 06 Aug 2026
Mps Alta Operation Manager
Company: Applied Materials |
Management Responsibilities Oversee facility operations supporting manufacturing, integration, and testing activitiesLocation: Hillsboro, OR, USA
| Salary: US$133200 - 183000 per year | Date posted: 05 Aug 2026
Principal Engineer, Module Development – Cmp
Company: Intel |
success through collaboration with integration, device, yield, defect metrology, quality, reliability, factory, and supplier... improvement, and process stabilization initiatives. Partner with integration, device, yield, factory, and customer engineeringLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 05 Aug 2026
Staff Semiconductor Device Modeling Engineer
Company: Intel |
. Collaborate across multiple teams and geographies to achieve seamless integration and optimized solutions. QualificationsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 05 Aug 2026
Applications Development Engineer
Company: KLA Corporation |
Semiconductor process integration (logic, memory, or packaging) Familiarity with optical modeling techniques (e.g., Drude-LorentzLocation: Hillsboro, OR, USA
| Salary: US$102000 - 173400 per year | Date posted: 04 Aug 2026
Teachers At Hillsboro Knowledge Beginnings
Company: KinderCare Education |
in English Our benefits meet you where you are. Were here to help our employees navigate the integration of work and lifeLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Aug 2026
Teachers At Hillsboro Kindercare
Company: KinderCare Education |
in English Our benefits meet you where you are. Were here to help our employees navigate the integration of work and lifeLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 01 Aug 2026
Digital Marketing & Product Integration Specialist
Company: Planar |
Job Description: POSITION: Digital Marketing & Product Integration Specialist WORK LOCATION: Hillsboro, Oregon... of company product offerings and ProAV industry. Product Integration: o Product Launches: Work as liaison between ProductLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 30 Jul 2026
Lead, Engineer – Fab Technology, Surface Preparation And Integration (spi)
Company: Entegris |
Job Title: Lead, Engineer Fab Technology, Surface Preparation and Integration (SPI) Job Description: Entegris... is seeking a Lead Fab Technology Engineer for Surface Preparation and Integration (SPI) based in North America to play a pivotalLocation: Hillsboro, OR, USA
| Salary: US$120000 - 150000 per year | Date posted: 28 Jul 2026
Key Account Technologist (advanced Packaging)
Company: Thermo Fisher Scientific |
challenges. As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid... packaging trends, including areas such as: Heterogeneous Integration Hybrid Bonding High Bandwidth Memory (HBM) ChipletsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 22 Jul 2026
Process Support Engineer Iv
Company: Applied Materials |
to meet customer process and integration requirements. Checks and approves operational quality of system equipmentLocation: Hillsboro, OR, USA
| Salary: US$128000 - 176000 per year | Date posted: 22 Jul 2026
Teacher At W L Henry Elementary School
Company: KinderCare Education |
navigate the integration of work and life: - Know your whole family is supported with discounted child care benefitsLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 18 Jul 2026
Process Integration Development Engineer
Company: Intel |
person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Process Integration and Yield Engineer... analysis In-depth knowledge of manufacturing process change, process characterization, and process integration. ExpertiseLocation: Hillsboro, OR, USA
| Salary: unspecified | Date posted: 15 Jul 2026
Instrumentation & Controls Engineer
Company: SSOE Group |
, and coordinated layouts for control devices, panels, and associated infrastructure. Support integration of controls for HVACLocation: Hillsboro, OR, USA
| Salary: US$80000 - 130000 per year | Date posted: 15 Jul 2026
Aptm Npi Integrator
Company: Intel |
packaging and technology development programs. The successful candidate will drive the integration of new technologies... Integration: Experience in integrating packaging processes with overall product manufacturing workflows. Package Design