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Assembly jobs in boise USA

85 assembly jobs found in boise: showing 51 - 85

Dram Design Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 May 2026
integration, assembly, and marketing. You will provide high-quality, efficient, and reliable memory solutions that optimize time
Process And Equipment Engineer - Photolithography
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 May 2026
management as well as resolving manufacturing line problems. Identify, diagnose and resolve assembly process related problems... assembly process related problems. Coordinate and execute process, equipment and material evaluation / optimization initiatives
Design Verification Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 May 2026
, assembly, and marketing. Together, you will develop high-quality, efficient, and reliable memory solutions that optimize time
Ate Process Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 22 May 2026
and resolve assembly process related problems. Coordinate and execute process, equipment and material evaluation / optimization
Sr. Product Development Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 21 May 2026
/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes...\. Chip-package-interaction (CPI) which includes assembly process understanding & effects of assembly stresses, package design
Senior / Principal Dram Product Development Engineer – Deg Technology
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 20 May 2026
Collaboration Collaborate with Design, Technology Development, DFT, Test, Reliability, Quality, Manufacturing, Probe, Assembly
Engineer, Cmp Process Development R&d
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 20 May 2026
, diagnose and resolve assembly process related problems. Coordinate and execute process, equipment and material evaluation
Signal And Power Integrity Lab Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 19 May 2026
tools (e.g. ADS, HSPICE) Mechanical design, assembly, and maintenance skills Excellent communication skills
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 17 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Member Of Technical Staff, Ai Engineering
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 15 May 2026
, or custom assembly (PTX/SASS) to unlock hardware capabilities. Collaborate with Hardware Architects to define features
Product Yield Enhancement (pye) Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 13 May 2026
defects introduced during process fabrication or package assembly. You will also be responsible for presenting... and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams to ensure corrective
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Jack In The Box - Team Member
Company: Feast Enterprises |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 May 2026
other duties as assigned or directed. Assembly Reads video monitor and assembles products using correct ingredients
Semiconductor Design Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 May 2026
towards standardization and group success. Work with marketing, probe, assembly, test, process integration, and product engineering groups
Facility Water Services Technician
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 May 2026
, kneeling, climbing ladders, and working with arms raised; regularly lift 2540 lbs. Operate hand-held tools for light assembly
Principal Process Engineer, Die Bonding
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 07 May 2026
. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology
Qc/qa Manager
Company: Primary Weapons Systems |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 05 May 2026
of issues. Provides and presents that data to be used for purchasing, assembly, manufacturing process, warranty
Semiconductor Design Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 29 Apr 2026
to work towards standardization and group success. Work with marketing, probe, assembly, test, process integration
Facilities Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 29 Apr 2026
-level cost models: CSA, MEP, sub-fab systems, and cleanroom build-out scope; 4\. Bottom-up estimating, assembly-level
Ram Shift Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 28 Apr 2026
between sites. Identify, diagnose, and resolve assembly process-related problems. Coordinate and execute process, equipment
Assembler (exentec)
Company: Exyte |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 27 Apr 2026
Diploma or GED required. 24 years of handson experience in electromechanical or manufacturing assembly. Experience..., torque values, and assembly sequences. Confident with measurements, tolerances, and fractionaltodecimal conversions
Staff Equipment Development Engineer - Advanced Packaging
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 25 Apr 2026
and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Microns products... Fundamental understanding of post probe and assembly process and equipment interactions. Understanding of related inline
Warehouse Laborer- Boise, Id
Company: Woodgrain |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 Apr 2026
and/or assembly lines Performs record entry and compiles worksheets and tickets from customer specification Maintains... diploma or GED with 0 - 3 years of experience required Familiarity with door components, finishing products and assembly
Warehouse Laborer- Boise, Id
Company: Woodgrain |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 23 Apr 2026
and/or assembly lines Performs record entry and compiles worksheets and tickets from customer specification Maintains... diploma or GED with 0 3 years of experience required Familiarity with door components, finishing products and assembly
Frontend Central Process Integration Senior Engineer
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 22 Apr 2026
to analyze parametric, probe, and quality data across both front-end and back-end assembly processes. Strong model-based problem
Senior Embedded Firmware Engineer
Company: General Dynamics |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 16 Apr 2026
Firmware Engineer. What Youll Get to Do: Develop embedded software using C and assembly languages on bare metal or embedded... programming ability (C/C++, assembly, scripting) Knowledge of low-level computer architecture (CPUs, Memory Management Units
Senior Embedded Firmware Engineer
Company: General Dynamics |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 16 Apr 2026
Firmware Engineer. What Youll Get to Do: Develop embedded software using C and assembly languages on bare metal or embedded... programming ability (C/C++, assembly, scripting) Knowledge of low-level computer architecture (CPUs, Memory Management Units
Field Service Engineer Iii
Company: Canon |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 15 Apr 2026
; and/or assembly or fabrication parts at distances close to the eyes. Working primarily in a cleanroom environment (wearing full clean
Senior Embedded Firmware Engineer
Company: General Dynamics |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 14 Apr 2026
Firmware Engineer. What Youll Get to Do: Develop embedded software using C and assembly languages on bare metal or embedded... programming ability (C/C++, assembly, scripting) Knowledge of low-level computer architecture (CPUs, Memory Management Units
Senior Embedded Firmware Engineer
Company: General Dynamics |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 14 Apr 2026
Firmware Engineer. What Youll Get to Do: Develop embedded software using C and assembly languages on bare metal or embedded... programming ability (C/C++, assembly, scripting) Knowledge of low-level computer architecture (CPUs, Memory Management Units
Hvac/r Operations Technician Job Description
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 10 Apr 2026
and maintenance processes. Meet physical job demands, including lifting and carrying 2540 pounds, performing light assembly
Staff Engineer, Aptd Backgrind/edge Trim
Company: Micron |

Location: Boise, ID, USA

| Salary: unspecified | Date posted: 09 Apr 2026
/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance